基本信息:
- 专利标题： 電子零件用接著劑
- 专利标题（英）：Adhesive for electronic component
- 专利标题（中）：电子零件用接着剂
- 申请号：TW097127275 申请日：2008-07-18
- 公开(公告)号：TW200911946A 公开(公告)日：2009-03-16
- 发明人： 早川明伸 HAYAKAWA, AKINOBU , 石澤英亮 ISHIZAWA, HIDEAKI , 竹田幸平 TAKEDA, KOHEI , 增井良平 MASUI, RYOHEI
- 申请人： 積水化學工業股份有限公司 SEKISUI CHEMICAL CO., LTD.
- 申请人地址： 日本
- 专利权人： 積水化學工業股份有限公司 SEKISUI CHEMICAL CO., LTD.
- 当前专利权人： 積水化學工業股份有限公司 SEKISUI CHEMICAL CO., LTD.
- 当前专利权人地址： 日本
- 代理人： 桂齊恆; 閻啓泰
- 优先权： 日本 JP2007-188623 20070719
- 主分类号： C09J
- IPC分类号： C09J
Provided is an adhesive for an electronic component. The adhesive has excellent coating properties and contamination resistance for a bonded electronic component, and a highly reliable electronic component can be obtained by using the adhesive. The liquid-state adhesive contains a curable compound, a curing agent and inorganic fine particles. The solubility parameter (SP value) of the liquid-state component contained is 8 or more but less than 11.The organic fine particles are mixture of inorganic fine particles (A), which have at least an average primary grain diameter of 50nm or less and a hydrophobization degree (M value) of 30 or more but not more than 50, and inorganic fine particles (B), which have an average primary grain diameter of 50nm or less and a hydrophobization degree (M value) of 60 or more.
公开/授权文献:
- TWI321148B 電子零件用接著劑 公开/授权日：2010-03-01