发明专利
TW200832556A 用以安排金屬沈積用之基板表面的方法及整合之系統 PROCESSES AND INTEGRATED SYSTEMS FOR ENGINEERING A SUBSTRATE SURFACE FOR METAL DEPOSITION
审中-公开
基本信息:
- 专利标题： 用以安排金屬沈積用之基板表面的方法及整合之系統 PROCESSES AND INTEGRATED SYSTEMS FOR ENGINEERING A SUBSTRATE SURFACE FOR METAL DEPOSITION
- 专利标题（英）：Processes and integrated systems for engineering a substrate surface for metal deposition
- 专利标题（中）：用以安排金属沉积用之基板表面的方法及集成之系统 PROCESSES AND INTEGRATED SYSTEMS FOR ENGINEERING A SUBSTRATE SURFACE FOR METAL DEPOSITION
- 申请号：TW096131990 申请日：2007-08-29
- 公开(公告)号：TW200832556A 公开(公告)日：2008-08-01
- 发明人： 葉斯帝 多迪 DORDI, YEZDI , 佛禮茲C 瑞德克 REDEKER, FRITZ C. , 約翰 柏依 BOYD, JOHN , 威廉 尤 THIE, WILLIAM , 第瑞區若巴里 阿瑞那吉拉 ARUNAGIRI, TIRUCHIRAPALLI , 亞瑟M 豪瓦德 HOWALD, ARTHUR M. , 楊格蘇克 亞歷山得 優 YOON, HYUNGSUK ALEXANDER , 喬漢 維湯曼 VERTOMMEN, JOHAN
- 申请人： 蘭姆研究公司 LAM RESEARCH CORPORATION
- 申请人地址： 美國
- 专利权人： 蘭姆研究公司 LAM RESEARCH CORPORATION
- 当前专利权人： 蘭姆研究公司 LAM RESEARCH CORPORATION
- 当前专利权人地址： 美國
- 代理人： 許峻榮
- 优先权： 美國 11/513,634 20060830 美國 11/514,038 20060830 美國 11/513,446 20060830
- 主分类号： H01L
- IPC分类号： H01L ; B65G
The embodiments provide processes and integrated systems that produce a metal-to-metal or a silicon-to-metal interface to enhance electro-migration performance, to provide lower metal resistivity, and to improve metal-to-metal or silicon-to-metal interfacial adhesion for copper interconnects. An exemplary method of preparing a substrate surface to selectively deposit a thin layer of a cobalt-alloy material on a copper surface of in an integrated system to improve electromigration performance of a copper interconnect is provided. The method includes removing contaminants and metal oxides from the substrate surface in the integrated system, and reconditioning the substrate surface using a reducing environment after removing contaminants and metal oxides in the integrated system. The method also includes selectively depositing the thin layer of cobalt-alloy material on the copper surface of the copper interconnect in the integrated system after reconditioning the substrate surface. Systems to practice the exemplary method described above are also provided.
公开/授权文献:
- TWI393186B 用以安排金屬沈積用之基板表面的方法及整合之系統 公开/授权日：2013-04-11