Provided are a bonding method and a bonding apparatus, by which bubbles in an adhesive layer can be reduced while ensuring uniformity of the adhesive layer at the time of application and suppressing fluctuation of the adhesive layer during manufacture. The bonding apparatus is provided with a first spin-coating apparatus (1) for coating one surface of a first substrate (P1) with an adhesive (B1); a second spin-coating apparatus for coating one surface of a second substrate (P2) with an adhesive (B2) thinner than the adhesive (B1) on the first substrate; a pre-irradiation section (4) for temporarily hardening the adhesive (B1) on the first substrate (P1); a bonding section (5) for bonding the surface of the first substrate (P1) whereupon the adhesive (B1) is applied, with the surface of the second substrate (P2) whereupon the adhesive (B2) is applied; and a post-irradiation section (6) for hardening the adhesives (B1, B2) between the first substrate (P1) and the second substrate (P2).