发明专利
TW200828455A 散熱型封裝件之製法及其所應用之散熱結構 METHOD FOR FABRICATING HEAT-DISSIPATING PACKAGE AND HEAT-DISSIPATING STRUCTURE APPLICABLE THERETO
审中-公开
基本信息:
- 专利标题： 散熱型封裝件之製法及其所應用之散熱結構 METHOD FOR FABRICATING HEAT-DISSIPATING PACKAGE AND HEAT-DISSIPATING STRUCTURE APPLICABLE THERETO
- 专利标题（英）：Method for fabricating heat-dissipating package and heat-dissipating structure applicable thereto
- 专利标题（中）：散热型封装件之制法及其所应用之散热结构 METHOD FOR FABRICATING HEAT-DISSIPATING PACKAGE AND HEAT-DISSIPATING STRUCTURE APPLICABLE THERETO
- 申请号：TW095149739 申请日：2006-12-29
- 公开(公告)号：TW200828455A 公开(公告)日：2008-07-01
- 发明人： 洪敏順 HUNG, MIN SHUN , 蔡和易 TSAI, HO YI , 黃建屏 HUANG, CHIEN PING , 廖俊明 LIAO, CHUN MING , 蕭承旭 HSIAO, CHENG HSU
- 申请人： 矽品精密工業股份有限公司 SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 申请人地址： 臺中縣潭子鄉大豐路3段123號
- 专利权人： 矽品精密工業股份有限公司 SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人： 矽品精密工業股份有限公司 SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人地址： 臺中縣潭子鄉大豐路3段123號
- 代理人： 陳昭誠
- 主分类号： H01L
- IPC分类号： H01L
A method for fabricating a heat-dissipating package and a heat-dissipating structure applicable thereto are disclosed. The method includes: mounting and electrically connecting to a chip carrier a semiconductor chip mounted with a heat-dissipating structure; disposing on the heat-dissipating structure a covering layer protrudingly formed with an abutting portion surrounding the covering layer, wherein plan view size of the heat-dissipating structure is greater than the desirable one of the package to position the chip carrier in a cavity of a packaging mold and encapsulate the heat-dissipating structure and semiconductor chip by encapsulant, and the abutting portion abuts against a top surface of the cavity and protects the heat-dissipating structure against warpage because speed of mold flow below the heat-dissipating structure exceeds that above, thereby lifting the heat-dissipating structure; and cutting the package and removing the encapsulant from the covering layer thereunder according to the desirable plan view size of the package.