发明专利
TW200715494A 影像感應器之封裝結構及其封裝方法 PACKAGE OF CMOS IMAGE SENSOR AND METHOD FOR PACKAGING THE SAME
审中-公开
基本信息:
- 专利标题： 影像感應器之封裝結構及其封裝方法 PACKAGE OF CMOS IMAGE SENSOR AND METHOD FOR PACKAGING THE SAME
- 专利标题（英）：Package of CMOS image sensor and method for packaging the same
- 专利标题（中）：影像感应器之封装结构及其封装方法 PACKAGE OF CMOS IMAGE SENSOR AND METHOD FOR PACKAGING THE SAME
- 申请号：TW094135940 申请日：2005-10-14
- 公开(公告)号：TW200715494A 公开(公告)日：2007-04-16
- 发明人： 蔡裕斌 TSAI, YU-PEN
- 申请人： 日月光半導體製造股份有限公司 ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 申请人地址： 高雄市楠梓加工區經三路26號
- 专利权人： 日月光半導體製造股份有限公司 ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人： 日月光半導體製造股份有限公司 ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人地址： 高雄市楠梓加工區經三路26號
- 代理人： 陳長文
- 主分类号： H01L
- IPC分类号： H01L
The present invention relates to a package of CMOS image sensor and method for packaging the same. The method of the invention comprises: (a) providing a wafer, the wafer having a plurality of chips, and each chip having a sensitization area and a plurality of connecting pads on a active surface; (b) providing a plurality of transparent plates, each transparent plates having a insulating material; (c) disposing the transparent plates on the wafer, each transparent plate is disposed on the corresponding chip, and the insulating material is around the sensitization area; (d) putting the wafer and the transparent plates into a mold; (e) filling compound into the mold; and (f) cutting the wafer to form a plurality of CMOS image sensor units. Whereby, by utilizing the transparent plates, the crack problem of the wafer can be resolved when cutting the wafer. Furthermore, the gap between each transparent plate can facilitate filling the compound.