基本信息:
- 专利标题： 包層合金底質及其製法 CLAD ALLOY SUBSTRATES AND METHOD FOR MAKING SAME
- 专利标题（英）：Clad alloy substrates and method for making same
- 专利标题（中）：包层合金底质及其制法 CLAD ALLOY SUBSTRATES AND METHOD FOR MAKING SAME
- 申请号：TW094119446 申请日：2005-06-09
- 公开(公告)号：TW200616725A 公开(公告)日：2006-06-01
- 发明人： 大衛柏 BERGSTROM, DAVID S. , 克里斯蕭 SCHOTT, KRIS J. , 馬克塔 TARHAY, MARK A.
- 申请人： 艾帝產業公司 ATI PROPERTIES, INC.
- 申请人地址： 美國
- 专利权人： 艾帝產業公司 ATI PROPERTIES, INC.
- 当前专利权人： 艾帝產業公司 ATI PROPERTIES, INC.
- 当前专利权人地址： 美國
- 代理人： 張文仁
- 优先权： 美國 10/865,060 20040610
- 主分类号： B21D
- IPC分类号： B21D
A method for producing a single-clad or multiple-clad product includes providing a welded assembly comprising a cladding material disposed on a substrate material. Both the substrate material and the cladding material are individually selected alloys. At least a first edge of the cladding material of the welded assembly does not extend to a first edge of the substrate material and thereby provides a margin between the first edges. A material that is an alloy having hot strength greater than the cladding material is within the margin and adjacent the first edge of the cladding material. The welded assembly is hot rolled to provide a hot rolled band, and the material within the margin inhibits the cladding material from spreading beyond the edge of the substrate material during the hot rolling. In certain embodiments of the methods, the substrate material is stainless steel and the cladding material is nickel or a nickel alloy.
公开/授权文献:
- TWI295594B 包層合金底質及其製法 CLAD ALLOY SUBSTRATES AND METHOD FOR MAKING SAME 公开/授权日：2008-04-11
信息查询:
EspacenetIPC结构图谱:
| B | 作业；运输 |
| --B21 | 基本上无切削的金属机械加工；金属冲压 |
| ----B21D | 金属板或管、棒或型材的基本无切削加工或处理；冲压 |