基本信息:
- 专利标题： 無鉛焊錫合金
- 专利标题（英）：Lead-free solder alloy
- 专利标题（中）：无铅焊锡合金
- 申请号：TW093137797 申请日：2004-12-07
- 公开(公告)号：TW200604349A 公开(公告)日：2006-02-01
- 发明人： 大西司 OHNISHI, TSUKASA , 八卷得郎 YAMAKI, TOKURO , 雨海正純 AMAGAI, MASAZUMI , 渡邊雅子 WATANABE, MASAKO
- 申请人： 千住金屬工業股份有限公司 SENJU METAL INDUSTRY CO., LTD.
- 申请人地址： 日本
- 专利权人： 千住金屬工業股份有限公司 SENJU METAL INDUSTRY CO., LTD.
- 当前专利权人： 千住金屬工業股份有限公司 SENJU METAL INDUSTRY CO., LTD.
- 当前专利权人地址： 日本
- 代理人： 林志剛
- 优先权： PCT PCT/JP2004/010803 20040729
- 主分类号： C22C
- IPC分类号： C22C
A mobile electronic device is very often dropped while in use or in transportation to cause the soldered portions of electronic parts to peel off due to an impact by the dropping. The inner coils or resistors or the like in an electronic device are subjected to a heat cycle that they generate heat to cause soldered portions to be heated to high temperature while in used and they are cooled while not in use. Conventional Sn-Ag based lead-free solder has not provided sufficient impact resistance or heat cycle resistance to fine portions such as bumps. This invention provides lead-free solder alloy that provides excellent impact resistance and heat cycle resistance to bumps. The lead-free solder alloy consists of less than 0.1-2.0 mass% of Ag, 0.01-0.1 mass% of Cu, 0.005-0.1 mass% of Zn, and the remaining portion of Sn, wherein Ga, Ge, P are added to the alloy, and Ni, Co are further added to the alloy.
公开/授权文献:
- TWI275648B 微小錫焊部之錫焊凸塊形成用無鉛焊錫合金 公开/授权日：2007-03-11