基本信息:
- 专利标题： 基板分割系統、基板製造裝置、基板劃線方法及基板分割方法
- 专利标题（英）：Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method
- 专利标题（中）：基板分割系统、基板制造设备、基板划线方法及基板分割方法
- 申请号：TW094107827 申请日：2005-03-15
- 公开(公告)号：TW200540131A 公开(公告)日：2005-12-16
- 发明人： 西尾仁孝 , 岡島康智 , 大島幸雄 , 大成弘行 , 吉本和宏
- 申请人： 三星鑽石工業股份有限公司
- 申请人地址： 日本
- 专利权人： 三星鑽石工業股份有限公司
- 当前专利权人： 三星鑽石工業股份有限公司
- 当前专利权人地址： 日本
- 代理人： 林鎰珠
- 优先权： 日本 2004-117374 20040315
- 主分类号： C03B
- IPC分类号： C03B
This invention is to provide a substrate dividing system, which is compact with a small installation area and can efficiently divide a substrate. A clamping apparatus (50) is provided to hold at least one side edge part of a mother board carried into a hollow rectangular parallelepiped mount (10) and is permitted to reciprocate along one side of the hollow rectangular parallelepiped mount (10). A pair of substrate dividing apparatuses for dividing the mother substrate clamped by the clamping apparatus (50) from the upper plane and the lower plane of the mother substrate, respectively, are provided on a dividing apparatus guide body (30) so as to move along a direction orthogonally intersecting with a moving direction of the clamping apparatus (50). At the time of moving the clamping apparatus (50) which is holding the mother substrate, the substrate supporting apparatus supports the mother substrate without sliding on the mother board.
公开/授权文献:
- TWI405732B 基板分割系統、基板製造裝置、基板劃線方法及基板分割方法 公开/授权日：2013-08-21