发明专利
TW200514223A 具最佳化線搭接定位之半導體封裝 SEMICONDUCTOR PACKAGE HAVING OPTIMIZED WIRE BOND POSITIONING
审中-公开
基本信息:
- 专利标题： 具最佳化線搭接定位之半導體封裝 SEMICONDUCTOR PACKAGE HAVING OPTIMIZED WIRE BOND POSITIONING
- 专利标题（英）：Semiconductor package having optimized wire bond positioning
- 专利标题（中）：具最优化线搭接定位之半导体封装 SEMICONDUCTOR PACKAGE HAVING OPTIMIZED WIRE BOND POSITIONING
- 申请号：TW093116597 申请日：2004-06-09
- 公开(公告)号：TW200514223A 公开(公告)日：2005-04-16
- 发明人： 羅伯J 溫卓 WENZEL, ROBERT J. , 彼得R 哈柏 HARPER, PETER R.
- 申请人： 飛思卡爾半導體公司 FREESCALE SEMICONDUCTOR, INC.
- 申请人地址： 美國
- 专利权人： 飛思卡爾半導體公司 FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人： 飛思卡爾半導體公司 FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址： 美國
- 代理人： 陳長文
- 优先权： 美國 10/457,632 20030609
- 主分类号： H01L
- IPC分类号： H01L
Closely-spaced bonding wires may be used in a variety of different packaging applications to achieve improved electrical performance. In one embodiment, two adjacent bonding wires within a wire grouping are closely-spaced if a separation distance D between the two adjacent wires is met for at least 50 percent of the length of the shorter of the two adjacent wires. In one embodiment, the separation distance D is at most two times a diameter of the wire having the larger diameter of the two adjacent wires. In another embodiment, the separation distance D is at most three times a wire-to-wire pitch between the two adjacent wires. Each wire grouping may include two of more closely-spaced wires. Wire groupings of closely-spaced bonding wires may be used to form, for example, power-signal-ground triplets, signal-ground pairs, signal-power pairs, or differential signal pairs or triplets.