Provided is a method of making circuit device capable of effectively producing a circuit device such as SIP or ISB wherein a plurality of circuit elements are integrally covered and supported by an insulative resin. In the circuit device of the present invention, an user's terminal 10, an ISB server 12 and an ISB mounting site 14 are connected by a communication network. The conditions that an ISB circuit device meeting an user's expectation should satisfy, for example, the outline size of ISB, terminal information, CAD data of circuit drawing, is transmitted from the user's terminal 10 to the ISB server 12. In addition to the delivery time or expenses of the ISB circuit device, the ISB server 12 also transmits the reliability evaluation result to the user's terminal 10. Besides, a mask data for making ISB circuit data is formed according to the received conditions and sent to the ISB mounting site 14. In the ISB mounting site 14, a manufacturing data coming from the ISB server 12 is received, and the ISB circuit device is produced and provided to users.