发明专利
TW200403297A 用以形成印刷電路板內藏電容器層的含有介電質填充物之樹脂及使用含有介電質填充物之樹脂形成介電質層之雙面銅箔積層板以及雙面銅箔積層板之製造方法 DIELECTRIC FILLER-CONTAINED RESIN FOR FORMING BUILT-IN CAPACITOR LAYER FOR PRINTED WIRING BOARD, DOUBLE-SIDED COPPER CLAD LAMINATE FORMING AN DIELECTRIC LAYER BY USE OF THE DIELECTRIC FILLER -CONTAINED RESIN, AND METHOD FOR MANUFACTURING THE DOUBLE-
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基本信息:
- 专利标题： 用以形成印刷電路板內藏電容器層的含有介電質填充物之樹脂及使用含有介電質填充物之樹脂形成介電質層之雙面銅箔積層板以及雙面銅箔積層板之製造方法 DIELECTRIC FILLER-CONTAINED RESIN FOR FORMING BUILT-IN CAPACITOR LAYER FOR PRINTED WIRING BOARD, DOUBLE-SIDED COPPER CLAD LAMINATE FORMING AN DIELECTRIC LAYER BY USE OF THE DIELECTRIC FILLER -CONTAINED RESIN, AND METHOD FOR MANUFACTURING THE DOUBLE-
- 专利标题（英）：Dielectric filler-contained resin for forming built-in capacitor layer for printed wiring board, double-sided copper clad laminate forming a dielectric layer by use of the said resin, and method for manufacturing the double-sided copper clad laminate
- 专利标题（中）：用以形成印刷电路板内藏电容器层的含有介电质填充物之树脂及使用含有介电质填充物之树脂形成介电质层之双面铜箔积层板以及双面铜箔积层板之制造方法 DIELECTRIC FILLER-CONTAINED RESIN FOR FORMING BUILT-IN CAPACITOR LAYER FOR PRINTED WIRING BOARD, DOUBLE-SIDED COPPER CLAD LAMINATE FORMING AN DIELECTRIC LAYER BY USE OF THE DIELECTRIC FILLER -CONTAINED RESIN, AND METHOD FOR MANUFACTURING THE DOUBLE-
- 申请号：TW092107369 申请日：2003-04-01
- 公开(公告)号：TW200403297A 公开(公告)日：2004-03-01
- 发明人： 松島敏文 MATSUSHIMA, TOSHIFUMI , 三輪英章 MIWA, HIDEAKI , 一柳彰 ICHIRYU, AKIRA , 山崎一浩 YAMAZAKI, KAZUHIRO , 佐藤哲朗 SATO, TETSURO , 桑子富士夫 KUWAKO, FUJIO
- 申请人： 三井金屬業股份有限公司 MITSUI MINING & SMELTING CO., LTD.
- 申请人地址： 日本
- 专利权人： 三井金屬業股份有限公司 MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人： 三井金屬業股份有限公司 MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人地址： 日本
- 代理人： 洪澄文
- 优先权： 日本 2002-099601 20020402
- 主分类号： C08L
- IPC分类号： C08L ; B32B ; C08K ; H01L ; H05K
The present invention provides a dielectric layer for a double-sided copper clad laminate to be used for forming a built-in capacitor layer, of which film thickness can be formed arbitrarily without a use of skeletal material and of which strength is high. To this end, the used are a dielectric filler-contained resin for forming a built-in capacitor layer for a printed wiring board, and so on which is provided through mixing binder resin and a dielectric filler. The binder resin comprises: epoxy resin (including hardening agent) of 20-80 parts by weight; aromatic polyamide resin polymer of 20-80 parts by weight soluble in solvent; and hardening accelerator to be added in proper quantity as needed. The dielectric filler is dielectric powder being essentially spherical and having perovskite structure. The dielectric filler further has an average particle diameter DIA of 0.1-1.0 &mgr; m, and cumulative weight particle diameter D50 of 0.2-2.0 &mgr; m according to a laser scattering particle size distribution analysis, and the value of degree of cohesion represented by D50/IA is 4.5 or less. DIA is obtained through image analysis.
公开/授权文献:
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C08 | 有机高分子化合物；其制备或化学加工；以其为基料的组合物 |
| ----C08L | 高分子化合物的组合物 |