基本信息:
- 专利标题： 레이저 기반 마킹 방법 및 장치
- 专利标题（英）：Laser-based marking method and apparatus
- 专利标题（中）：基于激光的标记方法和设备
- 申请号：KR2020137000076 申请日：2011-05-02
- 公开(公告)号：KR2020140000998U 公开(公告)日：2014-02-13
- 发明人： 델라로사조셉 , 네메라앤드리
- 申请人： 아이피지 포토닉스 코포레이션
- 申请人地址： ** Old Webster Road, Oxford, Massachusetts *****, United States of America
- 专利权人： 아이피지 포토닉스 코포레이션
- 当前专利权人： 아이피지 포토닉스 코포레이션
- 当前专利权人地址： ** Old Webster Road, Oxford, Massachusetts *****, United States of America
- 代理人： 박영복; 김용인
- 国际申请： PCT/US2011/034778 2011-05-02
- 国际公布： WO2012150926 2012-11-08
- 主分类号： B23K26/18
- IPC分类号： B23K26/18 ; B23K26/00 ; B23K26/352 ; C21D1/09
Method for marking a thin workpiece of the subject innovation are designed to prevent deformation of the workpiece. A plurality of lasers are opposite to the sides facing the workpiece so that each of the two sides are heat-treated. The laser may operate in a synchronous manner in side-by-side lines, each of which emits beams to each other. As a result, the workpiece does not show signs of deformation upon completion of the marking. The workpiece is made of one of plastic or metal, and has a thickness of less than 2 millimeters. Laser are configured respectively in one of the fiber lasers or gas lasers. Marking can be performed with a laser that is uniform or non-uniform structure, and annealing, and a piece, and a step of yungsak. Marking can be performed synchronously or sequentially. Further, if the marking can be used to cause a distortion of the surface in a more controlled or desired manner.
信息查询:
EspacenetIPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |
| ------B23K26/00 | 用激光束加工，例如焊接，切割，打孔 |
| --------B23K26/18 | .在被加工材料上采用吸收层，例如为作标记或起保护作用 |