基本信息:
- 专利标题: 전자 장치용 패키지 케이스
- 专利标题(英):Package case for electronic device
- 专利标题(中):电子设备包装盒
- 申请号:KR2020120001862 申请日:2012-03-09
- 公开(公告)号:KR200472061Y1 公开(公告)日:2014-04-02
- 发明人: 린창리앙
- 申请人: 보스핸드 엔터프라이즈 인크.
- 申请人地址: NO. **, INDUSTRY *RD RD., AN-NAN DISTRICT, TAINAN CITY ***, TAIWAN, R.O.C
- 专利权人: 보스핸드 엔터프라이즈 인크.
- 当前专利权人: 보스핸드 엔터프라이즈 인크.
- 当前专利权人地址: NO. **, INDUSTRY *RD RD., AN-NAN DISTRICT, TAINAN CITY ***, TAIWAN, R.O.C
- 代理人: 유미특허법인
- 优先权: TW100216032 2011-08-26
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L23/02
The present invention, by unifying the positions of the connection portions of the terminals and the leads, that the lead is accommodated crude stretching (延伸) from the electronic device accommodated in the (收容 槽) is simply by the machine and also quickly soldered to the respective terminals It provides a case for electronic device packages. Acceptable to accommodate the electronic device tank 22 and a plurality of supports (23) to have a formed housing 21 and, respectively, the housing (21 each having the top face toward the same side (先 端面) (231) ) protrudes out of the housing 21 from the inside of a package case for the electronic device that includes a plurality of terminals (3) which is stretched in the same direction, is fixed to each of the terminals (3), end face 231, a connecting plate which is supported by the support 32 corresponding to the front end face 231 provides a package for an electronic device case having, respectively.
公开/授权文献:
- KR2020130001530U 전자 장치용 패키지 케이스 公开/授权日:2013-03-06
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/48 | .用于向或自处于工作中的固态物体通电的装置,例如引线、接线端装置 |