基本信息:
- 专利标题： 박판형 히트파이프 구조의 냉각장치를 이용한 발광다이오드패키지
- 专利标题（英）：The light emitting diode package using the thin plate cooling apparatus of the heat pipe structure
- 专利标题（中）：一种采用薄板热管结构的冷却装置的发光二极管封装
- 申请号：KR2020090000282 申请日：2009-01-09
- 公开(公告)号：KR200456185Y1 公开(公告)日：2011-10-17
- 发明人： 최태훈 , 박훈재 , 이상목 , 김응주 , 김승수 , 황인기
- 申请人： 한국생산기술연구원
- 申请人地址： 충청남도 천안시 서북구 입장면 양대기로길 **
- 专利权人： 한국생산기술연구원
- 当前专利权人： 한국생산기술연구원
- 当前专利权人地址： 충청남도 천안시 서북구 입장면 양대기로길 **
- 代理人： 특허법인다인
- 优先权： KR1020080025520 2008-03-19
- 主分类号： H01L33/64
- IPC分类号： H01L33/64 ; H01L23/367
히트파이프, 발광다이오드, 박판형 금속하우징
The light emitting diode package using the thin plate cooling apparatus of the heat pipe structure is the light emitting diode element and the light-emitting diode with the lead frames that are connected to the element, the light-emitting diode connected to the device and the duplex is formed from a metal plate a thin plate to be the predetermined three-dimensional pattern formed and a cooling unit of the thin plate heat pipe structure including a refrigerant to be filled in the metal housing and the metal thin plate housing's interior. According to the present invention thus constructed, by spreading uniformly the heat by the thin plate cooling of the heat pipe structure unit to maximize the cooling efficiency, it has a simple structure to form a capillary by a fine clearance between the cooling pin, the thin plate metal housing and there is an effect that can be applied in various forms by forming a variety of forms. Heat pipe, the light-emitting diode, a thin plate metal housing
公开/授权文献:
- KR2020090009586U 박판형 히트파이프 구조의 냉각장치를 이용한 발광다이오드패키지 公开/授权日：2009-09-23