基本信息:
- 专利标题: 방열 시트, 방열 시트의 제조 방법 및 적층체
- 专利标题(英):HEAT DISSIPATION SHEET, METHOD FOR PRODUCING HEAT DISSIPATION SHEET, AND LAMINATE
- 申请号:KR1020197022230 申请日:2018-06-21
- 公开(公告)号:KR102476070B1 公开(公告)日:2022-12-12
- 优先权: JPJP-P-2017-123510 2017-06-23
- 国际申请: PCT/JP2018/023690 2018-06-21
- 国际公布: WO2018235919 2018-12-27
- 主分类号: H01L23/373
- IPC分类号: H01L23/373 ; H01L23/485 ; C08K7/00 ; C08L101/12 ; B32B27/06 ; B32B27/18 ; H05K3/38 ; H05K7/20
Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/34 | .冷却装置;加热装置;通风装置或温度补偿装置 |
----------H01L23/36 | ..为便于冷却或加热对材料或造型的选择,例如散热器 |
------------H01L23/373 | ...为便于冷却的器件材料选择 |