基本信息:
- 专利标题： 도금방법 및 도금체
- 专利标题（英）：KR102239209B1 - Plating method and plated metal
- 申请号：KR1020180127443 申请日：2018-10-24
- 公开(公告)号：KR102239209B1 公开(公告)日：2021-04-12
- 发明人： 마상영 , 정도영
- 申请人： 대산전자(주)
- 申请人地址： -*, Hyundaikia-ro, Bibong-my...
- 专利权人： 대산전자(주)
- 当前专利权人： 대산전자(주)
- 当前专利权人地址： -*, Hyundaikia-ro, Bibong-my...
- 代理人： 수안특허법인
- 主分类号： C25D5/02
- IPC分类号： C25D5/02 ; C25D5/12 ; C23C18/16
摘要：
제1금속및 제2금속이접합된접합금속(Clad metal)에서제1금속만을포함하는제1영역과상기제2금속만을포함하는제2영역및 제1금속과제2금속간 접촉부를포함하는제3영역중 제1영역및 제2영역을마스킹하는제1마스킹단계; 접합금속을제1도금액에침전시키는단계; 제1영역및 상기제2영역중 하나에, 처리된마스킹을제거하는제2마스킹단계; 적어도제2마스킹단계가수행된영역을제2도금액에침전시키는단계; 및제2마스킹이수행된영역및 제3영역을제3도금액에침전시키는단계;를포함하는, 도금법이제공된다.
摘要（英）：
In the clad metal to which the first metal and the second metal are bonded, including a first region including only the first metal, a second region including only the second metal, and a contact portion between the first metal and the second metal A first masking step of masking a first region and a second region of the third region; Precipitating the bonded metal in the first plating solution; A second masking step of removing the processed masking from one of the first region and the second region; Precipitating at least the area where the second masking step has been performed in a second plating solution; And depositing the second masked region and the third region in a third plating solution.
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C25 | 电解或电泳工艺；其所用设备 |
| ----C25D | 覆层的电解或电泳生产工艺方法；电铸；工件的电解法接合；所用的装置 |
| ------C25D5/00 | 以工艺方法为特征的电镀；工件的预处理或后处理 |
| --------C25D5/02 | .局部表面上的电镀 |