基本信息:
- 专利标题： 맞춤형 균일도 프로파일을 위한 전기도금 장치
- 专利标题（英）：ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE
- 申请号：KR1020190145020 申请日：2019-11-13
- 公开(公告)号：KR102205977B1 公开(公告)日：2021-01-21
- 发明人： 메이어,스티븐티. , 포터,데이빗더블유. , 버칼루,브라이언엘. , 라시,로버트
- 申请人： 노벨러스 시스템즈, 인코포레이티드
- 申请人地址： **** Cushing Parkway, Fremont, California ***** United States of America
- 专利权人： 노벨러스 시스템즈, 인코포레이티드
- 当前专利权人： 노벨러스 시스템즈, 인코포레이티드
- 当前专利权人地址： **** Cushing Parkway, Fremont, California ***** United States of America
- 代理人： 특허법인인벤싱크
- 优先权： US61/471,624 2011-04-04; US61/598,054 2012-02-13
- 主分类号： C25D17/00
- IPC分类号： C25D17/00 ; C25D5/04 ; C25D5/02 ; C25D21/10 ; C25D17/06 ; C25D21/12 ; H01L21/288 ; C25D7/12
An electroplating apparatus for electroplating metal on a substrate includes a plating chamber configured to contain an electrolyte, a substrate holder configured to hold and rotate the substrate during electroplating, an anode, and an azimuthally asymmetric auxiliary electrode configured to be biased both anodically and cathodically during electroplating. The azimuthally asymmetric auxiliary electrode (which may be, for example, C-shaped), can be used for controlling azimuthal uniformity of metal electrodeposition by donating and diverting ionic current at a selected azimuthal position. In another aspect, an electroplating apparatus for electroplating metal includes a plating chamber configured to contain an electrolyte, a substrate holder configured to hold and rotate the substrate during electroplating, an anode, a shield configured to shield current at the periphery of the substrate; and an azimuthally asymmetric auxiliary anode configured to donate current to the shielded periphery of the substrate at a selected azimuthal position on the substrate.
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C25 | 电解或电泳工艺；其所用设备 |
| ----C25D | 覆层的电解或电泳生产工艺方法；电铸；工件的电解法接合；所用的装置 |
| ------C25D17/00 | 电解镀覆用电解槽的结构件、或其组合件 |