基本信息:
- 专利标题: 로봇 조립체들, 기판 프로세싱 장치, 및 전자 디바이스 제조에서 기판들을 운송하기 위한 방법들
- 专利标题(英):KR20180061393A - Of the robot assembly, the substrate processing apparatus, and electronic device manufacturing method for transferring a substrate from
- 申请号:KR20187014572 申请日:2016-09-28
- 公开(公告)号:KR20180061393A 公开(公告)日:2018-06-07
- 优先权: US201514921806 2015-10-23
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01L21/677
Robot assembly allows for the remote actuation of a carriage supporting the robot. Robotic assembly includes a robot mounted on a track, a carriage movable along a track as possible, and the carriage. The robot includes at least a first arm, and a first arm coupled to the first driven (driven) member. Robot assembly further comprises a drive assembly having a first drive (driving) member, first drive member and the coupled to the first transmission member, and a first drive member coupled to the first driven piece first drive motor do. A first drive motor is adapted to cause a first by moving the drive member, remote rotation of the first driven member and the rotation of the first arm. The substrate processing apparatus and a substrate processing unit how to transport the substrate in a are also provided with a number of different aspects.
公开/授权文献:
- KR102182483B1 로봇 조립체들, 기판 프로세싱 장치, 및 전자 디바이스 제조에서 기판들을 운송하기 위한 방법들 公开/授权日:2020-11-24
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置;专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |