基本信息:
- 专利标题： 도전막 및 이의 제조 방법
- 专利标题（英）：A conductive film and a method for their preparation
- 专利标题（中）：导电膜及其制造方法
- 申请号：KR20177029526 申请日：2015-12-16
- 公开(公告)号：KR20180008414A 公开(公告)日：2018-01-24
- 发明人： FUJITA HIDEFUMI , KANEDA SHUJI , ITOH DAISUKE
- 申请人： DOWA ELECTRONICS MATERIALS CO
- 专利权人： DOWA ELECTRONICS MATERIALS CO
- 当前专利权人： DOWA ELECTRONICS MATERIALS CO
- 优先权： JP2015051888 2015-03-16
- 主分类号： H01B5/14
- IPC分类号： H01B5/14 ; H01B1/22 ; H01B13/00 ; H05K3/12
摘要：
[과제] 종이기재위에형성된구리의도전막에있어서, 내후성및 도전성이현저하게개선된것을제공한다. [해결수단] 상기과제는종이기재위에서구리분말함유도막중의구리입자가소결한소결도전막을상기기재와함께가압하여형성한도전막으로서, 두께방향으로평행한도전막단면에서차지하는구리의면적율이 82.0% 이상인도전막에의해달성된다. 이도전막은광 소성후에, 예를들면롤 프레스에의해 90 내지 190℃에서가압함으로써제조할수 있다.
摘要（中）：
本发明提供一种在纸基材上形成的铜的导电膜，其耐候性和导电性显着提高。 [解决问题的手段]的分配，以通过与上述含有粉末的铜涂覆基材烧结的铜颗粒的导电膜所述的压纸被烧结在形成限制导电膜，铜的面积比在平行占用82.0％，以限制导电膜部分在厚度方向上比 是由导电膜实现的。 过渡金属膜可以通过例如在光烧制后通过辊压在90-190℃下压制而制得。
摘要（英）：
[PROBLEMS] provides that the paper according to the conductive film of copper formed on a substrate, weather resistance and conductivity remarkably improved.
[MEANS FOR SOLVING PROBLEMS] The problem is a copper powder-containing conductive film by sintering the copper particles are sintered conductive film of the coating film formed by pressing with the base material, the copper area ratio of share of the parallel conductive film section in the thickness direction of 82.0 on the paper base material % or more is achieved by the conductive film. After the conductive film is an optical plastic, for instance by pressing at 90 to 190 ℃ by a roll press may be prepared.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01B | 电缆；导体；绝缘体；导电、绝缘或介电材料的选择 |
| ------H01B5/00 | 按形状区分的非绝缘导体或导电物体 |
| --------H01B5/14 | .在绝缘支承物上有导电层或导电薄膜的 |