基本信息:
- 专利标题： 캐리어 웨이퍼와 접착필름을 부착하는 진공 라미네이터 및 그 작동방법
- 专利标题（英）：A vacuum laminator for bonding adhesive film to carrier wafer and a method for operating the same
- 专利标题（中）：真空层压机连接载体薄膜和胶膜及操作方法
- 申请号：KR1020160078382 申请日：2016-06-23
- 公开(公告)号：KR1020180000429A 公开(公告)日：2018-01-03
- 发明人： 심세진 , 오성민
- 申请人： (주)크렌텍
- 申请人地址： 경기도 수원시 영통구 신원로 ***, *동 ***호 (원천동,영통이노플렉스-*단지)
- 专利权人： (주)크렌텍
- 当前专利权人： (주)크렌텍
- 当前专利权人地址： 경기도 수원시 영통구 신원로 ***, *동 ***호 (원천동,영통이노플렉스-*단지)
- 代理人： 한양특허법인
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/18 ; H01L21/78 ; H01L21/677 ; H01L21/447
The present invention relates to a vacuum laminator and method that operate to attach the carrier wafer and an adhesive film. Vacuum laminator to attach the carrier wafer and an adhesive film according to the present invention, the shape of the first film body (1) to be corresponding to the shape of the carrier wafer (C / W) and half-cut, the carrier wafer (C / W) forming a second film body (2) corresponding to the cutting apparatus 100; Second, remove the film body (2) from the cutting device 10, the robot transfer device (300) for feeding to the interior of the vacuum chamber 200; Includes; and in the interior of the vacuum chamber 200, a press apparatus 400 that are formed by depositing the second film body (2) on the top surface of the carrier wafer (C / W) to form an intermediate assembly (3) . According to the invention, a vacuum bonding process to attach the protective film on both surfaces of the adhesive film, the adhesive film body to the carrier wafer to increase productivity and to occur continuously in a single line.
公开/授权文献:
- KR101819162B1 캐리어 웨이퍼와 접착필름을 부착하는 진공 라미네이터 및 그 작동방법 公开/授权日：2018-02-28
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |