基本信息:
- 专利标题： 레이저 가공장치 및 이를 이용한 레이저 가공방법
- 专利标题（英）：Laser processing apparatus
- 专利标题（中）：激光加工装置及使用其的激光加工方法
- 申请号：KR1020160012904 申请日：2016-02-02
- 公开(公告)号：KR1020170092171A 公开(公告)日：2017-08-11
- 发明人： 강태민 , 김재식 , 김정국 , 조영석
- 申请人： 삼성디스플레이 주식회사
- 申请人地址： 경기 용인시 기흥구 삼성로*(농서동)
- 专利权人： 삼성디스플레이 주식회사
- 当前专利权人： 삼성디스플레이 주식회사
- 当前专利权人地址： 경기 용인시 기흥구 삼성로*(농서동)
- 代理人： 리앤목특허법인
- 主分类号： H01L51/56
- IPC分类号： H01L51/56 ; H01L21/268 ; H01L51/00
The present invention is positioned on the path of the laser beam emitted from the structure as that for the laser processing apparatus and a laser processing method using the same, which can execute a variety of forms processing while minimizing the element changes, the laser beam source, the laser beam source the located in at least the paths of the two laser beams of the laser beam a laser beam branch, and a plurality of laser beam after said laser beam branch to branch of the emitted laser beam from the source into a plurality of laser beam and the at least two to provide a laser processing method comprising a position correcting portion that can adjust the distance between the laser beam passes with a refractive index difference with the surroundings, the laser processing apparatus, and it passes through the laser beam.
公开/授权文献:
- KR102481383B1 레이저 가공장치 및 이를 이용한 레이저 가공방법 公开/授权日：2022-12-27