基本信息:
- 专利标题： 실장용 기판 및 그 제조 방법, 및, 부품 실장 방법
- 专利标题（英）：Mounting board, method for producing same, and method for mounting component
- 专利标题（中）：用于生产它们的安装板方法和用于安装组件的方法
- 申请号：KR1020167025825 申请日：2015-02-27
- 公开(公告)号：KR1020160138024A 公开(公告)日：2016-12-02
- 发明人： 와타나베토시히코
- 申请人： 소니 세미컨덕터 솔루션즈 가부시키가이샤
- 申请人地址： *-**-* Asahi-cho, Atsugi, Kanagawa JAPAN
- 专利权人： 소니 세미컨덕터 솔루션즈 가부시키가이샤
- 当前专利权人： 소니 세미컨덕터 솔루션즈 가부시키가이샤
- 当前专利权人地址： *-**-* Asahi-cho, Atsugi, Kanagawa JAPAN
- 代理人： 최달용
- 优先权： JPJP-P-2014-065302 2014-03-27
- 国际申请： PCT/JP2015/055785 2015-02-27
- 国际公布： WO2015146476 2015-10-01
- 主分类号： H05K3/34
- IPC分类号： H05K3/34 ; H05K1/03 ; H05K1/11 ; H01L33/62
Through hole 13, a part attached to the first land portion 21, a second land portion 31, the first component attachment portion 22, the second of the formed on the mounting substrate includes a substrate 10, part 32, the top surface of the conductive layer 14, and the through holes 13, the land portion 21 side filling member 15 of it is provided with a filling member (15) filled in a portion, of the first of the volume of the portion of the through-hole 15 which is located above the (V h), the length of the first component attachment portion (22) parts (51) to be mounted on the (L 1), component mounting portions of the first ( 22) on the basis of the maximum allowable value of the inclination of the first surface 11 of the substrate 10 of the component 51 to be mounted shortest distance to the first land portion 21, the center part (51) from the in the limit (L 0) is determined.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/02 | .其中将导电材料敷至绝缘支承物的表面上，而后再将其导电材料从不希望让电流通导或屏蔽的表面区域中去除的 |
| ----------H05K3/32 | ..电元件或导线与印刷电路的电连接 |
| ------------H05K3/34 | ...通过焊接的 |