基本信息:
- 专利标题： 반도체 소자용 지지 기판, 이를 포함하는 반도체 장치 및 이를 제조하는 방법
- 专利标题（英）：Supporting substrate for semiconductor device, semiconductor apparatus with the same and method of manufacturing the same
- 专利标题（中）：用于其半导体器件半导体器件的支撑衬底及其制造方法
- 申请号：KR1020160155973 申请日：2016-11-22
- 公开(公告)号：KR1020160137485A 公开(公告)日：2016-11-30
- 发明人： 안상정
- 申请人： 안상정
- 申请人地址： 인천광역시 연수구 아트센터대로**번길 **, ****호 ****호 (송도동, 송도더샵하버뷰* **단지)
- 专利权人： 안상정
- 当前专利权人： 안상정
- 当前专利权人地址： 인천광역시 연수구 아트센터대로**번길 **, ****호 ****호 (송도동, 송도더샵하버뷰* **단지)
- 主分类号： H01L33/62
- IPC分类号： H01L33/62 ; H01L23/00
This disclosure includes the steps of preparing a first substrate having a second surface facing the first surface and the first surface according to a method of making a support substrate for a semiconductor element; First from the first surface side on the first substrate to form a groove facing toward the second surface; Forming a conductive portion in the groove; Comprising the steps of combining a second substrate to the first substrate at the first surface side; And, in the second surface side, forming a first conductive pads to be conductive and the conductive portion; support for a semiconductor device produced using a process for producing a supporting substrate for a semiconductor device comprising a and the way the substrate relates to a method of manufacturing a semiconductor device and a semiconductor device including the same.