基本信息:
- 专利标题： 방열막을 구비한 반도체 패키지 및 그 제조방법
- 专利标题（英）：Semiconductor packages having heat spreaders and methods for fabricating the same
- 专利标题（中）：具有散热器的半导体封装及其制造方法
- 申请号：KR1020150077974 申请日：2015-06-02
- 公开(公告)号：KR1020160121764A 公开(公告)日：2016-10-20
- 发明人： 김재춘 , 황희정 , 장언수
- 申请人： 삼성전자주식회사
- 申请人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 专利权人： 삼성전자주식회사
- 当前专利权人： 삼성전자주식회사
- 当前专利权人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 代理人： 특허법인 고려
- 优先权： KR1020150050149 2015-04-09
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/28
The present invention relates to a semiconductor package and a method of manufacturing the package the semiconductor chip provided on the substrate, the semiconductor radiation film provided on a chip, the semiconductor chip and the surrounding the heat radiating side of the membrane the mold layer, and the semiconductor chip and the heat dissipation film comprises a film adhesive provided between. Film as the heat radiation and if the reverse side of the adhesive film when provided comprises a top surface not covered by the molded film. The heat dissipation film is extended along the upper surface of the heat dissipation film has a thickness from one parallel to the direction to the direction when the further comprises a hole through the heat dissipation film.
公开/授权文献:
- KR102392202B1 방열막을 구비한 반도체 패키지 및 그 제조방법 公开/授权日：2022-05-02
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |