基本信息:
- 专利标题： 전기도금용 지그 및 이를 이용한 도금물 제조 방법
- 专利标题（英）：A jig for electroplating and a method of manufacturing an electroplated article
- 专利标题（中）：电镀用夹具及电镀制品的制造方法
- 申请号：KR1020150018865 申请日：2015-02-06
- 公开(公告)号：KR1020160097446A 公开(公告)日：2016-08-18
- 发明人： 한정원
- 申请人： 삼성디스플레이 주식회사
- 申请人地址： 경기 용인시 기흥구 삼성로*(농서동)
- 专利权人： 삼성디스플레이 주식회사
- 当前专利权人： 삼성디스플레이 주식회사
- 当前专利权人地址： 경기 용인시 기흥구 삼성로*(농서동)
- 代理人： 리앤목특허법인
- 主分类号： C25D17/08
- IPC分类号： C25D17/08 ; C25D5/00
One embodiment of the invention electrical Fig. Finance jig for performing plating contains plating bath is plating liquid is stored, the base and, arranged so as to cover the base is formed with a cover, the base and the cover including an opening for the plating solution to pass through disposed in the interior space and a is interposed between the substrate disposed in contact with the electrode which is connected electrically with an external power source energized and the one surface of the electrode, the cover and the substrate, is formed so as to correspond to at least a portion of the opening substrate and an opening for exposing a portion in a plating solution, discloses an electroplating jig which includes an intermediate member including a recessed groove is concavely formed in the outer side direction from the inner side surface of the region adjacent to the substrate.
公开/授权文献:
- KR102250050B1 전기도금용 지그 및 이를 이용한 도금물 제조 방법 公开/授权日：2021-05-11
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C25 | 电解或电泳工艺；其所用设备 |
| ----C25D | 覆层的电解或电泳生产工艺方法；电铸；工件的电解法接合；所用的装置 |
| ------C25D17/00 | 电解镀覆用电解槽的结构件、或其组合件 |
| --------C25D17/02 | .镀槽；镀槽的安装 |
| ----------C25D17/08 | ..挂具 |