基本信息:
- 专利标题： 전력용 반도체 모듈 어셈블리
- 专利标题（英）：Power semiconductor module assembly
- 专利标题（中）：功率半导体模块组件
- 申请号：KR1020140051415 申请日：2014-04-29
- 公开(公告)号：KR1020150124656A 公开(公告)日：2015-11-06
- 发明人： 박민호
- 申请人： 엘에스산전 주식회사
- 申请人地址： 경기도 안양시 동안구 엘에스로 *** (호계동)
- 专利权人： 엘에스산전 주식회사
- 当前专利权人： 엘에스산전 주식회사
- 当前专利权人地址： 경기도 안양시 동안구 엘에스로 *** (호계동)
- 代理人： 김기문
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
One embodiment of the semiconductor module assembly for power due to the present invention, includes a main board coupled to the power semiconductor module and the power semiconductor module, the semiconductor module for the power is accommodated in the interior of the case and the case and the semiconductor element for the plurality of electric power, being connected to the semiconductor element for the electric power comprises a plurality of pin connectors in which a plurality of connecting pins projecting to the upper part of the case and cover a portion of the plurality of connection pins, said plurality of pin connectors each of which is connected a plurality of connecting pins electrically for covering at least one of said plurality of pin connector is connected to the main board, the main board is characterized in that it comprises a gate driver which is provided on the printed circuit board It shall be.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/48 | .用于向或自处于工作中的固态物体通电的装置，例如引线、接线端装置 |