基本信息:
- 专利标题: 인쇄 회로 기판 장착 장치
- 专利标题(英):Apparatus for mounting a printed circuit board
- 专利标题(中):安装印刷电路板的装置
- 申请号:KR1020150028886 申请日:2015-03-02
- 公开(公告)号:KR1020150105215A 公开(公告)日:2015-09-16
- 发明人: 머레이네일지주니어 , 램세이마크
- 申请人: 티알더블유 오토모티브 유.에스. 엘엘씨
- 申请人地址: ***** TECH CENTER DRIVE, LIVONIA, MICHIGAN *****, U.S.A
- 专利权人: 티알더블유 오토모티브 유.에스. 엘엘씨
- 当前专利权人: 티알더블유 오토모티브 유.에스. 엘엘씨
- 当前专利权人地址: ***** TECH CENTER DRIVE, LIVONIA, MICHIGAN *****, U.S.A
- 代理人: 김태홍; 김진회
- 优先权: US14/199,294 2014-03-06
- 主分类号: H05K7/14
- IPC分类号: H05K7/14 ; H05K7/08 ; H05K7/12
Circuit provides a substrate mounting unit, the future device includes a circuit board and the press-fitted bushing, the mounting bushing includes an outer piece fixed to the cylindrical inner piece and the inner piece. Outer pieces are provided with a plurality of deformable radially projecting elements, the circuit board is provided with a cylindrical aperture with a diameter smaller than the outer diameter of the projecting elements deformable radially. The deformable element is deformed when they be put mounting bushing is pushed into the cylindrical aperture of the circuit board, maintains the bushing mounted on the circuit board. Then, the circuit board and the press-fitted bushings are overmolded.
公开/授权文献:
- KR101702746B1 인쇄 회로 기판 장착 장치 公开/授权日:2017-02-06
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K7/00 | 对各种不同类型电设备通用的结构零部件 |
--------H05K7/14 | .在外壳内或在框架上或在导轨上安装支承结构 |