基本信息:
- 专利标题： 자기 차폐부를 가지는 반도체 패키지 제조방법
- 专利标题（英）：The method of fabricating a semiconductor package including a magnetic shield
- 专利标题（中）：制造包括磁性屏蔽的半导体封装的方法
- 申请号：KR1020140020671 申请日：2014-02-21
- 公开(公告)号：KR1020150099118A 公开(公告)日：2015-08-31
- 发明人： 장재권 , 박진우 , 이종호
- 申请人： 삼성전자주식회사
- 申请人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 专利权人： 삼성전자주식회사
- 当前专利权人： 삼성전자주식회사
- 当前专利权人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 代理人： 특허법인 고려
- 主分类号： H01L23/08
- IPC分类号： H01L23/08 ; H05K9/00
Form a crack in a grid on the active surface of the electrode terminals are formed in the wafer. And grinding the back side of the wafer facing the active surface. And attaching a tape to the active face of the wafer. And customizing the wafer by increasing the tape to the semiconductor chips. To form a shielding layer on the semiconductor chips and the tape. By cutting a shield layer between the semiconductor chips, the individualized semiconductor chips by the first shield pattern formed on the rear and side of the semiconductor chip. And attaching the semiconductor chip to the substrate. To form a second shield pattern in each active surface of the semiconductor chip. The semiconductor chips and the substrate is an electrical method for manufacturing a semiconductor package that is physically connected by a bonding wire is proposed.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/02 | .容器；封接 |
| ----------H01L23/04 | ..按外形区分的 |
| ------------H01L23/08 | ...其材料是电绝缘体的，例如玻璃 |