基本信息:
- 专利标题： 발광 다이오드 패키지
- 专利标题（英）：LED package
- 专利标题（中）：LED封装
- 申请号：KR1020140018032 申请日：2014-02-17
- 公开(公告)号：KR1020150097021A 公开(公告)日：2015-08-26
- 发明人： 김정진 , 손민영 , 권용민
- 申请人： 삼성전자주식회사
- 申请人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 专利权人： 삼성전자주식회사
- 当前专利权人： 삼성전자주식회사
- 当前专利权人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 代理人： 리앤목특허법인
- 主分类号： H01L33/36
- IPC分类号： H01L33/36
The LED package according to the technical features of the present invention, when the contact with the first electrode pad and the second electrode pad of the light emitting structure, a first electrode pad and the second electrode pad, the light emitting structure that is connected to the light emitting structure insulating pattern layer and, in contact with the lower surface of the insulating pattern layer defining an insulating covering the first electrode pad and the lower face of the inner wall and the substrate in the substrate, the via hole via hole is formed to expose a portion of the second electrode pad layer, and the first electrode pad and the second the first through-electrode and the second through-electrode formed in the via hole is the insulating layer covered and such that each connected to the electrode pad, a fluorescent material layer formed on the light emitting structure and a light emitting diode package characterized in that interposed between the fluorescent material layer comprises a light emitting structure and the spaced glass.
公开/授权文献:
- KR102116986B1 발광 다이오드 패키지 公开/授权日：2020-05-29