基本信息:
- 专利标题: 반도체 패키지 및 그 제조 방법
- 专利标题(英):Semiconductor package and method of manufacturing the same
- 专利标题(中):半导体封装及其制造方法
- 申请号:KR1020140014687 申请日:2014-02-10
- 公开(公告)号:KR1020150093981A 公开(公告)日:2015-08-19
- 发明人: 이창배 , 박노일 , 박승욱
- 申请人: 삼성전기주식회사
- 申请人地址: Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 专利权人: 삼성전기주식회사
- 当前专利权人: 삼성전기주식회사
- 当前专利权人地址: Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 代理人: 특허법인씨엔에스
- 主分类号: H01L25/04
- IPC分类号: H01L25/04
The semiconductor package according to the present invention, a printed circuit board; A first semiconductor element and the second as a semiconductor element, the second semiconductor element is larger the first semiconductor element and the second semiconductor elements than the first semiconductor element of the laminated structure mounted on one surface of the printed circuit board; And variations of the first semiconductor element close to the second and the empty space between the semiconductor element and the printed circuit board includes at least one third element is at least partially disposed, without modification of the printed circuit board and electronic components, and it is possible to maximize space utilization efficiency in a simple manufacturing process without the improvements it is possible to minimize the size of the semiconductor package.
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
--------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件,例如整流二极管的组装件 |
----------H01L25/04 | ..不具有单独容器的器件 |