基本信息:
- 专利标题： 패키지 기판 및 그 제조방법 및 그를 이용한 전력 모듈 패키지
- 专利标题（英）：Package Substrate and Manufacturing Method for the same and Power module Package using the same
- 专利标题（中）：包装基板及其制造方法及使用其的功率模块封装
- 申请号：KR1020130145575 申请日：2013-11-27
- 公开(公告)号：KR1020150061441A 公开(公告)日：2015-06-04
- 发明人： 장범식 , 송성민
- 申请人： 삼성전기주식회사
- 申请人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 专利权人： 삼성전기주식회사
- 当前专利权人： 삼성전기주식회사
- 当前专利权人地址： Maeyoung-Ro *** (Maetan-Dong), Youngtong-Gu, Suwon-Si, Gyeonggi-Do, Republic of Korea
- 代理人： 특허법인씨엔에스
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; H01L23/34
摘要：
본발명은패키지기판및 그제조방법및 그를이용한전력모듈패키지에관한것이다. 본발명의일 실시예에따른패키지기판은일면에전자소자접합부및 전자소자접합부의일측면에형성된돌출부를갖는기판, 기판의일면에형성되는절연층및 절연층상에형성되는회로패턴을포함하며, 돌출부는연결부재접합부인상면부와상면부로올라갈수록수렴하도록경사진제 1 측면부및 제2 측면부를가진다.
摘要（中）：
封装基板及其制造方法技术领域本发明涉及封装基板及其制造方法以及使用其的电源模块封装。 根据本发明的一个实施方案的封装基板包括：基板，其在其一侧包括电子器件接合部分和在电子器件接合部分的一侧上的突出部分，形成在电子器件接合部分的一侧上的绝缘层 基板和形成在绝缘层上的电路图案。 突起部包括作为连接部件接合部的顶面和倾斜于会聚到顶面的第一侧和第二侧。
摘要（英）：
The present invention relates to a package substrate and a manufacturing method thereof, and a power module package using the same.
Package substrate according to an embodiment of the present invention includes the circuit pattern formed on the insulating layer and the insulating layer in which a substrate having a projection formed on one side of the electronic element bonding portion and the electronic element abutment on one side, formed on one surface of the substrate , the projection has an oblique first side and a second side face so as to converge toward the top surface portion up portion and the upper surface of the connecting member junction.