基本信息:
- 专利标题： 조정가능한 복합 인터포저
- 专利标题（英）：Tunable composite interposer
- 专利标题（中）：TUNABLE复合式插座
- 申请号：KR1020157008732 申请日：2013-09-12
- 公开(公告)号：KR1020150053952A 公开(公告)日：2015-05-19
- 发明人： 워이치크찰스쥐. , 우조사이프리안이메카 , 사토히로아키
- 申请人： 인벤사스 코포레이션
- 申请人地址： **** Orchard Parkway, San Jose, California *****, U.S.A.
- 专利权人： 인벤사스 코포레이션
- 当前专利权人： 인벤사스 코포레이션
- 当前专利权人地址： **** Orchard Parkway, San Jose, California *****, U.S.A.
- 代理人： 리앤목특허법인
- 优先权： US13/613,611 2012-09-13
- 国际申请： PCT/US2013/059520 2013-09-12
- 国际公布： WO2014043390 2014-03-20
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/48 ; H01L25/065 ; H01L25/16 ; H01L25/18
Composite interposer may comprise a substrate element and the support element. The substrate element may have a conductive structure extending through the first and second, and may have opposite surfaces, wherein the plurality of contacts exposed on a first surface and a thickness defining a thickness of less than 200 microns. The support element is extended in at least some of the openings in the thickness direction of the openings in at least one body of a dielectric material or a semiconductor material exposed on the second surface of the support element, extend through the thickness of said body, said body of the conductive via (via conductive) in, and may have a a terminal exposed at a first surface of the support element. The second surface of the support element may be integrated with the second surface of the substrate element. The terminal can be connected through the conductive via and the conductive structure to the contacts electrically.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/34 | .冷却装置；加热装置；通风装置或温度补偿装置 |
| ----------H01L23/482 | ..由不可拆卸地施加到半导体本体上的内引线组成的 |
| ------------H01L23/498 | ...引线位于绝缘衬底上的 |