基本信息:
- 专利标题： 납땜 장치 및 납땜 제품의 제조방법
- 专利标题（英）：Soldering apparatus and method for manufacturing soldered product
- 专利标题（中）：用于制造焊接产品的焊接设备和方法
- 申请号：KR1020147032884 申请日：2013-04-24
- 公开(公告)号：KR1020150010759A 公开(公告)日：2015-01-28
- 发明人： 구로다마사미 , 마쓰다준 , 스즈키다카유키
- 申请人： 오리진 일렉트릭 캄파니 리미티드
- 申请人地址： *-*-**, Sakawa, Sakura-ku, Saitama-shi, Saitama Japan
- 专利权人： 오리진 일렉트릭 캄파니 리미티드
- 当前专利权人： 오리진 일렉트릭 캄파니 리미티드
- 当前专利权人地址： *-*-**, Sakawa, Sakura-ku, Saitama-shi, Saitama Japan
- 代理人： 강일우
- 优先权： JPJP-P-2012-099967 2012-04-25
- 国际申请： PCT/JP2013/062063 2013-04-24
- 国际公布： WO2013161875 2013-10-31
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23K1/005 ; B23K1/008 ; B23K3/047 ; H05K3/34 ; B23K3/04 ; B23K3/08 ; B23K101/42 ; B23K101/36
It provides excellent soldering apparatus and method of manufacturing the brazing product that can be soldered to work efficiently in a short cycle time. Soldering apparatus, and the heat radiation heater for heating the workpiece to be soldered by the thermal radiation, soldered to cooling the workpiece, is arranged sandwiched between a heat radiation heater, two coolers to move between the standby position and the cooling position a, 2 provided with a recess a condenser forming part for installing the heat radiation heater sandwiching of the two coolers, chillers, thermal radiation, while the heater heats the workpiece, thermal radiation heating the workpiece so that the protruding state from the recess separated by being configured to be movable from the standby position to wait, when the cooler cools the workpiece and is configured to be movable from a standby position to a cooling position.
公开/授权文献:
- KR101660622B1 납땜 장치 및 납땜 제품의 제조방법 公开/授权日：2016-09-27
信息查询:
EspacenetIPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |
| ------B23K1/00 | 钎焊，如硬钎焊或脱焊 |