基本信息:
- 专利标题： 반도체 패키지
- 专利标题（英）：Semiconductor Package
- 专利标题（中）：半导体封装
- 申请号：KR1020130081786 申请日：2013-07-11
- 公开(公告)号：KR1020150007604A 公开(公告)日：2015-01-21
- 发明人： 장철용 , 장애니 , 김영룡
- 申请人： 삼성전자주식회사
- 申请人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 专利权人： 삼성전자주식회사
- 当前专利权人： 삼성전자주식회사
- 当前专利权人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 代理人： 리앤목특허법인
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
A semiconductor package, and a package substrate having a board connection pad, is stacked on the package substrate, the at least one extending in the first direction toward the side edges from the chip connection pad side on the upper surface covering at least a portion of the chip connection pad extending along at least one semiconductor chip, and a side of the semiconductor chip having the rewiring layer (redistribution layer), comprising at least one wire electrically connecting the redistribution layer and the substrate connection pads, the re-distribution layer It is, protrude from the edge side of the semiconductor chip and the tangent line, and a is the area of the vertical cross-section in the first projection direction changing along the first direction.
公开/授权文献:
- KR102099878B1 반도체 패키지 公开/授权日：2020-04-10
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/48 | .用于向或自处于工作中的固态物体通电的装置，例如引线、接线端装置 |