基本信息:
- 专利标题： 반도체 발광소자 패키지 제조방법
- 专利标题（英）：Method for manufacturing semiconductor light emitting device package
- 专利标题（中）：制造半导体发光器件封装的方法
- 申请号：KR1020130073090 申请日：2013-06-25
- 公开(公告)号：KR1020150000676A 公开(公告)日：2015-01-05
- 发明人： 권용민 , 김정진 , 김학환 , 임성준
- 申请人： 삼성전자주식회사
- 申请人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 专利权人： 삼성전자주식회사
- 当前专利权人： 삼성전자주식회사
- 当前专利权人地址： ***, Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, Republic of Korea
- 代理人： 특허법인씨엔에스
- 主分类号： H01L33/36
- IPC分类号： H01L33/36 ; H01L33/52 ; H01L33/48 ; H01L33/62
One embodiment of the invention, the method comprising: providing a wafer formed body is a semiconductor laminated for a plurality of light emitting device - a, and the electrode of the semiconductor laminated body is arranged - each light-emitting element regions of the semiconductor stacked body electrode is arranged the through hole comprising the steps of: applying a curable resin to the surface, followed by curing the curable resin and the step of forming a through hole in the support structure and forming a support structure for the semiconductor laminate, so that the electrodes are exposed, semiconductor provides a light emitting device package manufacturing method comprising the step of forming a connection electrode on the support structure such that the electrode and connection to the exposure.