基本信息:
- 专利标题: 표면 처리 동박
- 专利标题(英):Surface treated copper foil
- 专利标题(中):表面处理铜箔
- 申请号:KR1020147032635 申请日:2011-11-22
- 公开(公告)号:KR1020140140649A 公开(公告)日:2014-12-09
- 发明人: 오바타신이치 , 히라오카신야 , 호소코시후미아키 , 다테오카아유무 , 마츠시마히데아키 , 미야케고이치 , 도모나가사키코 , 마에다도모유키
- 申请人: 미쓰이금속광업주식회사
- 申请人地址: *-**-* Osaki, Shinagawa-ku, Tokyo ***-****, Japan
- 专利权人: 미쓰이금속광업주식회사
- 当前专利权人: 미쓰이금속광업주식회사
- 当前专利权人地址: *-**-* Osaki, Shinagawa-ku, Tokyo ***-****, Japan
- 代理人: 장수길; 성재동
- 优先权: JPJP-P-2010-260369 2010-11-22; JPJP-P-2011-158177 2011-07-19
- 国际申请: PCT/JP2011/076955 2011-11-22
- 国际公布: WO2012070589 2012-05-31
- 主分类号: C25D7/06
- IPC分类号: C25D7/06 ; C23C28/00 ; C25D5/10 ; H05K1/09
An object of the present invention is the provision of the excellent in softening characteristics which can suppress a decrease in the tensile strength after heat treatment at a temperature of about 350 ℃ ~400 ℃ copper foil. In order to achieve this object, a surface-treated copper foil having an anti-corrosive treatment layer on both sides of a copper foil, the art anti-corrosive treatment layer is composed of zinc, and also zinc or amount of any surface 20㎎ / ㎡~1000㎎ / ㎡ zinc layer, and the copper foil and the art employs a carbon, sulfur, chlorine, surface-treated copper foil, characterized in that contains one or two or more kinds of trace components selected from nitrogen, less than their total content is 100ppm and the like.
信息查询:
EspacenetIPC结构图谱:
C | 化学;冶金 |
--C25 | 电解或电泳工艺;其所用设备 |
----C25D | 覆层的电解或电泳生产工艺方法;电铸;工件的电解法接合;所用的装置 |
------C25D7/00 | 以施镀制品为特征的电镀 |
--------C25D7/06 | .丝;带;箔 |