基本信息:
- 专利标题： 부품용 금속 재료, 그것을 사용한 커넥터 단자, 커넥터 및 전자 부품
- 专利标题（英）：Metallic material for electronic component, connector terminal obtained using same, connector, and electronic component
- 专利标题（中）：用于电子元件的金属材料，使用其的连接器端子，连接器和电子元件
- 申请号：KR1020147029427 申请日：2013-01-25
- 公开(公告)号：KR1020140139021A 公开(公告)日：2014-12-04
- 发明人： 시부야요시타카 , 후카마치가즈히코 , 고다마아츠시
- 申请人： 제이엑스금속주식회사
- 申请人地址： *-*, Otemachi *-chome, Chiyoda-ku, Tokyo, Japan
- 专利权人： 제이엑스금속주식회사
- 当前专利权人： 제이엑스금속주식회사
- 当前专利权人地址： *-*, Otemachi *-chome, Chiyoda-ku, Tokyo, Japan
- 代理人： 특허법인코리아나
- 优先权： JPJP-P-2012-068148 2012-03-23; JPJP-P-2012-112634 2012-05-16
- 国际申请： PCT/JP2013/051633 2013-01-25
- 国际公布： WO2013140850 2013-09-26
- 主分类号： C23C28/02
- IPC分类号： C23C28/02 ; C23C10/00
-0.66 [여기서, (Sn ＋ In 비율) ≥ 10 mass％ 이다] 이다.
Jeosap utterance, a metal material for electronic parts having a low whisker resistance and high durability, and provides a connector terminal, a connector and electronic components using the same. Metallic material for electronic components, the substrate, and the on Ni, Cr, Mn, Fe, Co, and having a lower layer consisting of at least one selected from the group consisting of Cu and, Sn, and In (A on the lower base are either or both, and the thickness of the lower layer having a top layer, and consisting of 1 species or an alloy consisting of two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (B constituent elements) of the constituent elements) 0.05 and ㎛ or more, a thickness of the upper layer at least 0.005 ㎛ below 0.6 ㎛, in the upper layer, a constituent element / (a constituent element + B constituent element) (hereinafter referred to, Sn + in ratio) [mass%] and the coating thickness is the relation of [㎛], plating thickness × 8.2 ≤ (Sn + in ratio)
-0.66 wherein, the (in + Sn ratio) ≥ 10 mass%].
公开/授权文献:
- KR101678289B1 부품용 금속 재료, 그것을 사용한 커넥터 단자, 커넥터 및 전자 부품 公开/授权日：2016-11-21