基本信息:
- 专利标题： 헤비 와이어 본딩 방법
- 专利标题（英）：Method of heavy wire bonding
- 专利标题（中）：헤비와이어본딩방법
- 申请号：KR1020130042478 申请日：2013-04-17
- 公开(公告)号：KR1020140124664A 公开(公告)日：2014-10-27
- 发明人： 유정호 , 김양욱 , 손정현 , 장영훈 , 김영근
- 申请人： 대우전자부품(주)
- 申请人地址： 전북 정읍시 공단*길 *, (망제동)
- 专利权人： 대우전자부품(주)
- 当前专利权人： 대우전자부품(주)
- 当前专利权人地址： 전북 정읍시 공단*길 *, (망제동)
- 代理人： 한양특허법인
- 主分类号： H01L21/607
- IPC分类号： H01L21/607
The invention wire relates to bonding, jimyeo first placed the first bonding material and adjacent to the second bonding material, the bonding preparation step to be joined ready, the first joining material and the second pressing portion formed on the possible welding device moves on top of the bonding material of claim 1 the first bonding material bonding step is a metal wire projecting to the same time the pressure and also presses the first joint part formed in the joining material is joined to the first junction, and subsequently discharged to the metallic line from the pressing portion, the joining device is a second bonding material and second with the second bonding material bonding preparation steps which is moved to press the second abutment, urges the second joint pressing portion at the same time is formed a second joining material bonding step the second joint and the metal wire is to be bonded, the metal wire is 1gf by more than a breaking load, and characterized in that the first joint and the second joint or separate, because the joints made by ultrasonic bonding and metal lines, and provides a heavy wire bonding method with an easy integration effect.
公开/授权文献:
- KR101464189B1 헤비 와이어 본딩 방법 公开/授权日：2014-11-21
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |
| ----------------H01L21/607 | .....包括运用机械振动的，例如超声振动 |