基本信息:
- 专利标题: 와이어 본드 비아를 갖는 패키지-온-패키지 어셈블리
- 专利标题(英):Package-on-package assembly with wire bond vias
- 专利标题(中):包装封装组装与线束VIAS
- 申请号:KR1020147013295 申请日:2012-10-16
- 公开(公告)号:KR1020140085517A 公开(公告)日:2014-07-07
- 发明人: 차우엘리스 , 코레이날도 , 알라토레로젠 , 댐버그필립 , 왕웨이-슌 , 양세영 , 자오지준
- 申请人: 인벤사스 코포레이션
- 申请人地址: **** Orchard Parkway, San Jose, California *****, U.S.A.
- 专利权人: 인벤사스 코포레이션
- 当前专利权人: 인벤사스 코포레이션
- 当前专利权人地址: **** Orchard Parkway, San Jose, California *****, U.S.A.
- 代理人: 유미특허법인
- 优先权: US13/404,408 2012-02-24; US13/404,458 2012-02-24; US13/405,108 2012-02-24; US61/547,930 2011-10-17
- 国际申请: PCT/US2012/060402 2012-10-16
- 国际公布: WO2013059181 2013-04-25
- 主分类号: H01L25/10
- IPC分类号: H01L25/10 ; H01L23/31 ; H01L23/495 ; H01L23/498 ; H01L23/28 ; H01L21/48
Microelectronic package 10 may include a wire bond 32, a wire bond 32, a base 34 and a base 34 bonded to the respective conductive elements 28 on the substrate 12, It has an end 36 of the other side. It had a dielectric encapsulation layer 42 extends from the substrate 12, to cover the portion of the wire bonds (32) so as to be separated from each other by the encapsulation layer 42, the portion covered wire bonds 32, wherein the wire is defined by a portion of the bond 32, the capsule 39 of the encapsulation layer 42, wire bonds 32 that are not covered by the non-migration of. Encapsulation not part 39 that can be arranged at a position of the pattern having a large minimum pitch than the first minimum pitch between the base 34 of the adjacent wire bonds (32).
公开/授权文献:
- KR101904410B1 와이어 본드 비아를 갖는 패키지-온-패키지 어셈블리 公开/授权日:2018-10-05
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L25/00 | 由多个单个半导体或其他固态器件组成的组装件 |
--------H01L25/03 | .所有包含在H01L27/00至H01L51/00各组中同一小组内的相同类型的器件,例如整流二极管的组装件 |
----------H01L25/10 | ..具有单独容器的器件 |