基本信息:
- 专利标题: 연마를 위한 모델 기반 스펙트럼 라이브러리의 생성
- 专利标题(英):Varying coefficients and functions for polishing control
- 专利标题(中):改变系统和功能的抛光控制
- 申请号:KR1020137031251 申请日:2012-04-13
- 公开(公告)号:KR1020140028028A 公开(公告)日:2014-03-07
- 发明人: 데이비드,제프리드루 , 벤베그누,도미닉제이. , 후,시아오위안
- 申请人: 어플라이드 머티어리얼스, 인코포레이티드
- 申请人地址: **** Bowers Avenue, Santa Clara, CA *****, U.S.A.
- 专利权人: 어플라이드 머티어리얼스, 인코포레이티드
- 当前专利权人: 어플라이드 머티어리얼스, 인코포레이티드
- 当前专利权人地址: **** Bowers Avenue, Santa Clara, CA *****, U.S.A.
- 代理人: 양영준; 백만기
- 优先权: US13/096,714 2011-04-28; US13/096,777 2011-04-28
- 国际申请: PCT/US2012/033677 2012-04-13
- 国际公布: WO2012148716 2012-11-01
- 主分类号: H01L21/304
- IPC分类号: H01L21/304 ; H01L21/00
Method of generating a library of reference spectra storing the optical model for the layer stack having a plurality of layers; And refractive index function and the function extinction coefficient function for each combination of extinction coefficients of the functions of the set of the set of, and a step of calculating the reference spectrum using an optical model. Another method of generating a library of reference spectra comprising the steps of: receiving a user input identifying a plurality of different contribution ratio of the at least one of the first stack or second stack on the substrate; And a second step of calculating the reference spectrum from the second spectrum and the contribution ratio of the first spectrum, the second stack on a first stack for each of a plurality of contribution rates different contribution ratio.
公开/授权文献:
- KR101981814B1 연마를 위한 모델 기반 스펙트럼 라이브러리의 생성 公开/授权日:2019-05-23
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
------------H01L21/18 | ...器件有由周期表第Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料 |
--------------H01L21/26 | ....用波或粒子辐射轰击的 |
----------------H01L21/302 | .....改变半导体材料的表面物理特性或形状的,例如腐蚀、抛光、切割 |
------------------H01L21/304 | ......机械处理,例如研磨、抛光、切割 |