A cutting device using a wire saw according to the present invention comprises: a base part mounted on a main body; position-changeable frame units connected to the base part, but enabling the position to change; and a wire saw circulating through the position-changeable frame units. In order to make the wire saw cut a space between a pair of bored holes formed on a work space while moving forward therebetween, the position-changeable frame units are inserted in the pair of bored holes by adjusting the position. According to the present invention, the wire saw can easily cut the space between the pair of bored holes while moving forward because the position-changeable frame units are accurately inserted in the pair of arbitrary bored holes by adjusting the position. Thus, the present invention can prevent environmental pollution by minimizing vibration and noise caused due to the deconstruction of a structure or the excavation of rocks, and can obtain excellent work efficiency. Also, the present invention can increase economical efficiency by reducing the amount of used chemicals.