基本信息:
- 专利标题: 반도체 소자 탑재용 패키지 기판의 제조 방법, 반도체 소자 탑재용 패키지 기판 및 반도체 패키지
- 专利标题(英):Method for producing package substrate for mounting semiconductor element, package substrate for mounting semiconductor element, and semiconductor package
- 专利标题(中):生产用于安装半导体元件的封装衬底的方法,用于安装半导体元件的封装衬底和半导体封装
- 申请号:KR1020137025239 申请日:2012-03-09
- 公开(公告)号:KR1020130129292A 公开(公告)日:2013-11-27
- 发明人: 타무라타다시 , 카와사키사오리 , 와카바야시아키히코 , 스즈키쿠니지 , 츠보마츠요시아키
- 申请人: 히타치가세이가부시끼가이샤
- 申请人地址: *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 专利权人: 히타치가세이가부시끼가이샤
- 当前专利权人: 히타치가세이가부시끼가이샤
- 当前专利权人地址: *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 代理人: 특허법인원전
- 优先权: JPJP-P-2011-051378 2011-03-09; JPJP-P-2011-078583 2011-03-31
- 国际申请: PCT/JP2012/056125 2012-03-09
- 国际公布: WO2012121373 2012-09-13
- 主分类号: H01L23/12
- IPC分类号: H01L23/12
It can correspond to high density and reliability in a manufacturing process such as to provide a package substrate for mounting a semiconductor device excellent. First between the first carrier foil and a second carrier foil and a step of preparing a multi-layer metal foil laminated to the base metal foil, and laminated with a base material to form a core substrate, and a first carrier foil of the multilayer metal foil and a second carrier foil, a first step of peeling the carrier foil is physically and second carrier foil step of performing a first pattern plating on and, to form the first insulating layer and the conductor circuit and the interlayer connection on the pattern-plated to form a laminate process and a laminating step of separating the body from the core board with a carrier foil and a method of manufacturing a substrate for semiconductor element mounting package having a step of forming a buried three-dimensional circuit or circuits by etching or the like.
公开/授权文献:
- KR101585305B1 반도체 소자 탑재용 패키지 기판의 제조 방법, 반도체 소자 탑재용 패키지 기판 및 반도체 패키지 公开/授权日:2016-01-13
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/12 | .安装架,例如不可拆卸的绝缘衬底 |