基本信息:
- 专利标题： 고밀도 잭
- 专利标题（英）：High density jack
- 专利标题（中）：高密度杰克
- 申请号：KR1020137009940 申请日：2011-09-08
- 公开(公告)号：KR1020130127440A 公开(公告)日：2013-11-22
- 发明人： 디에츠,윌리암,에이치. , 커플스,케네스,에이. , 슐루터,리차드,더블유.
- 申请人： 오트로닉스, 인크
- 申请人地址： *** Eugene O'Neill Drive, New London, CT *****, U.S.A.
- 专利权人： 오트로닉스, 인크
- 当前专利权人： 오트로닉스, 인크
- 当前专利权人地址： *** Eugene O'Neill Drive, New London, CT *****, U.S.A.
- 代理人： 인비전 특허법인
- 优先权： US12/889,996 2010-09-24
- 国际申请： PCT/US2011/050822 2011-09-08
- 国际公布： WO2012039949 2012-03-29
- 主分类号： H01R13/74
- IPC分类号： H01R13/74
The present invention provides the / a housing an electrical connector or jack assembly for use in voice / data communication system. More particularly, the present invention provides a modular jack assembly comprising a movable locking member. The present invention provides improved systems / designs for the jack assembly / housing that is easily fixed to the jack or jacks panel faceplate and / or jack or jack panel easily separated from the face plate. In an exemplary embodiment, the present invention is serviced by the preferred modular jack assembly and associated assembly including a possible locking member easily (e.g., in the field), the jack assemblies / housing to the jack panel / face plate provide fixed and / or easily separated from the jack panel / faceplate, convenient, cost-effective systems and methods.
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01R | 导电连接；一组相互绝缘的电连接元件的结构组合；连接装置；集电器 |
| ------H01R13/00 | H01R12/14或H01R24/00至H01R33/00组中所包含的各种连接装置的零部件 |
| --------H01R13/73 | .把连接部件安装到设备或结构上的装置，例如安装到墙上的 |
| ----------H01R13/74 | ..在面板的孔中固定连接件的装置 |