基本信息:
- 专利标题： 기판 표면에 금속 증착물을 형성하는 방법 및 그 용도
- 专利标题（英）：Method for forming a metal deposit on the surface of a substrate, and uses thereof
- 专利标题（中）：在基材表面形成金属沉积的方法及其用途
- 申请号：KR1020137002861 申请日：2011-07-04
- 公开(公告)号：KR1020130124940A 公开(公告)日：2013-11-15
- 发明人： 실뱅,쟝-프랑수와 , 뱅쌩,세실 , 하인츠,쟝-마르끄
- 申请人： 상뜨로 나쇼날 드 라 러쉐르쉐 샹띠피크
- 申请人地址： 프랑스 파리 에프-***** 뤼 미셀 앙즈 *
- 专利权人： 상뜨로 나쇼날 드 라 러쉐르쉐 샹띠피크
- 当前专利权人： 상뜨로 나쇼날 드 라 러쉐르쉐 샹띠피크
- 当前专利权人地址： 프랑스 파리 에프-***** 뤼 미셀 앙즈 *
- 代理人： 특허법인오리진
- 优先权： FR1055422 2010-07-05
- 国际申请： PCT/FR2011/051563 2011-07-04
- 国际公布： WO2012004501 2012-01-12
- 主分类号： C23C22/77
- IPC分类号： C23C22/77 ; C23C22/82
Functionalized in 1) -OP, -OPO the substrate surface, -OS, or -OSO group (grouping): The present invention relates to a method of forming a metal deposition on the surface of the solid substrate, the method comprising at least the following the method comprising; 2) mixing the substrate with metal or metal oxide particles to sublime at a low temperature; 3) a step of heat-treating the substrate obtained after the step 2), wherein step 3) is carried out only when the metal in the above step 2) is used, the step 3) is also performed at a temperature below the temperature of melting the metal in question and the step is carried out in the additional air in the oxidation of the metal; And 4) in 0.1Tf to less than the temperature Tf in a reducing atmosphere, the step 3) a step of reducing a metal oxide in a metal oxide and a step 2) obtained from, Tf is the melting temperature expressed in degrees Kelvin, the metal-oxide the reduction and free oxygen atoms of the metal and / or co-sublimation of the metal oxide, followed by a sulfur atom of a sulfur atom, a group of the OS personnel Here, OS group of -OP group attached to the metal atom, the substrate, or OPO or a group -OSO coupling, the reduction step. The invention also relates to the use of the method for improving the thermal conductivity of the use of the method, in particular the manufacture of powder metallurgy, casting the reinforcing material, or material.
公开/授权文献:
- KR101787025B1 기판 표면에 금속 증착물을 형성하는 방법 및 그 용도 公开/授权日：2017-10-18