基本信息:
- 专利标题： 다이싱·다이본드 필름
- 专利标题（英）：Dicing die-bonding film
- 专利标题（中）：定制电影胶片
- 申请号：KR1020137027287 申请日：2008-10-30
- 公开(公告)号：KR1020130122025A 公开(公告)日：2013-11-06
- 发明人： 가미야가쯔히꼬 , 마쯔무라다께시 , 무라따스우헤이
- 申请人： 닛토덴코 가부시키가이샤
- 申请人地址： 일본국 오사카후 이바라키시 시모호츠미 *-*-*
- 专利权人： 닛토덴코 가부시키가이샤
- 当前专利权人： 닛토덴코 가부시키가이샤
- 当前专利权人地址： 일본국 오사카후 이바라키시 시모호츠미 *-*-*
- 代理人： 장수길; 이중희
- 优先权： JPJP-P-2007-291056 2007-11-08; JPJP-P-2007-314899 2007-12-05
- 国际申请： PCT/JP2008/069798 2008-10-30
- 国际公布： WO2009060787 2009-05-14
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; C09J7/02
Workpiece holding force when dicing the workpiece, even if bakhyeongin and, the chip-shaped workpiece obtained by dicing the die-bonding film and is excellent in dicing the balance characteristics of the separation performance at the time of peeling integrally die-bonding It provides a film. The dicing die-bonding film of the present invention, and a dicing film having a pressure-sensitive adhesive layer on the base material, the die having a die-bonding film formed on the pressure-sensitive adhesive layer dicing and die-bonding film, the pressure-sensitive adhesive layer, the acrylic ester as a main monomer and containing hydroxyl groups in the content range of 10 to 30mol% with respect to the acrylic acid ester monomer and a hydroxyl group-containing monomer in the content of a radical reactive carbon in the range of 70 to 90mol% with respect - the isocyanate compound having carbon-carbon double bond and contains a polymer that is configured to contain, the die-bonding film is characterized by being constituted by containing an epoxy resin.
公开/授权文献:
- KR101420993B1 다이싱·다이본드 필름 公开/授权日：2014-07-17
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |
| ----------H01L21/71 | ..限定在组H01L21/70中的器件的特殊部件的制造 |
| ------------H01L21/78 | ...把衬底连续地分成多个独立的器件 |