基本信息:
- 专利标题： 치환 금 도금액 및 접합부의 형성 방법
- 专利标题（英）：Gold displacement plating solution, and method for formation of joint part
- 专利标题（中）：黄金位移解决方案，以及联合部分的形成方法
- 申请号：KR1020127008272 申请日：2011-04-15
- 公开(公告)号：KR1020130100229A 公开(公告)日：2013-09-10
- 发明人： 기쿠치리에
- 申请人： 니혼 엘렉트로플레이팅 엔지니어스 가부시키가이샤
- 申请人地址： *-*-*, Marunouchi, Chiyoda-ku, Tokyo, Japan
- 专利权人： 니혼 엘렉트로플레이팅 엔지니어스 가부시키가이샤
- 当前专利权人： 니혼 엘렉트로플레이팅 엔지니어스 가부시키가이샤
- 当前专利权人地址： *-*-*, Marunouchi, Chiyoda-ku, Tokyo, Japan
- 代理人： 문두현
- 优先权： JPJP-P-2010-190195 2010-08-27
- 国际申请： PCT/JP2011/059351 2011-04-15
- 国际公布： WO2012026159 2012-03-01
- 主分类号： C23C18/44
- IPC分类号： C23C18/44 ; C23C18/34 ; C23C18/16 ; C23C18/54 ; H05K3/24 ; C23C18/38
The present invention, a nickel layer, in forming the palladium layer, the junction formed by sequentially laminating a gold layer, and provides a replacement gold plating solution and the plating treatment technique capable of realizing a uniform film thickness. The present invention, on a conductor layer composed of a conductive metal, a nickel layer, a palladium layer, a substitution gold plating solution for sequentially laminating a gold layer to form the formed junction, substitution gold plating solution, cyanide geumyeom, complexing agents (錯 化 劑), intended to contain a copper compound, the molar ratio of complexing agent and copper compound in the substitution gold plating solution is in the range of the ignition / copper ions = 1.0 to 500, the stability at the pH of 4~6, compounds formed by the complexing agent and copper compound It characterized in that the constant is less than 8.5.
公开/授权文献:
- KR101768927B1 치환 금 도금액 및 접합부의 형성 방법 公开/授权日：2017-08-17