基本信息:
- 专利标题： 금속 표면의 처리 방법 및 그에 의해 형성된 장치
- 专利标题（英）：Methods of treating metal surfaces and devices formed thereby
- 专利标题（中）：处理金属表面的方法及其形成的器件
- 申请号：KR1020137003164 申请日：2010-07-06
- 公开(公告)号：KR1020130041178A 公开(公告)日：2013-04-24
- 发明人： 우에젼-치에 , 리우즈밍 , 시스티븐제트. , 쿠어워너쥐.
- 申请人： 아토테크 도이칠란드 게엠베하
- 申请人地址： 독일 데-***** 베를린 에라스무스 슈트라세 **
- 专利权人： 아토테크 도이칠란드 게엠베하
- 当前专利权人： 아토테크 도이칠란드 게엠베하
- 当前专利权人地址： 독일 데-***** 베를린 에라스무스 슈트라세 **
- 代理人： 리앤목특허법인
- 国际申请： PCT/US2010/041061 2010-07-06
- 国际公布： WO2012005722 2012-01-12
- 主分类号： C09J5/02
- IPC分类号： C09J5/02 ; C23C22/63 ; C23C22/83 ; H05K3/38 ; C23C8/12 ; C23C8/16 ; C23C18/12
Embodiments of the invention generally relates to the treatment of metal surfaces to the method, and it is formed by the device for improving the adhesion or bonding to the substrate. In some embodiments of the present invention, a method of obtaining enhanced bond strength it is provided without roughening the topography of the metal surface. The metal surface obtained by this method provides a strong bond to the resin layer. The bond between the treated metal and the resin layer surface indicates the resistance to heat, moisture, and chemicals involved in the stage after the lamination process, and thus can be suitably used in PCB manufacturing. The method according to some embodiments of the present invention are useful for the PCB with a circuit having a line / interval following the production of particularly high-density multi-layer PCB, in particular 10 microns. Method in accordance with another embodiment of the present invention is particularly useful in a wide range of applications, particularly for coating a metal surface.
公开/授权文献:
- KR101822118B1 금속 표면의 처리 방법 및 그에 의해 형성된 장치 公开/授权日：2018-01-25
信息查询:
EspacenetIPC结构图谱:
| C | 化学；冶金 |
| --C09 | 染料；涂料；抛光剂；天然树脂；黏合剂；其他类目不包含的组合物；其他类目不包含的材料的应用 |
| ----C09J | 黏合剂；一般黏合方法（非机械部分）；其他类目不包括的黏合方法；黏合剂材料的应用 |
| ------C09J5/00 | 一般黏合方法；其他类目不包含的黏合方法 |
| --------C09J5/02 | .涉及被接合的表面的预处理 |