基本信息:
- 专利标题： 전자 결합 구조, 다층 전송선로판, 전자 결합 구조의 제조 방법, 및 다층 전송선로판의 제조 방법
- 专利标题（英）：Inductive coupling structure, multi-layer transmission-line plate, method of manufacturing inductive coupling structure, and method of manufacturing multi-layer transmission-line plate
- 专利标题（中）：感应耦合结构，多层传输线板，制造感应耦合结构的方法以及制造多层传输线板的方法
- 申请号：KR1020127025802 申请日：2011-03-03
- 公开(公告)号：KR1020130038210A 公开(公告)日：2013-04-17
- 发明人： 미즈시마에츠오 , 콘도우유우스케 , 미즈노야스유키 , 와타나베야스시
- 申请人： 히타치가세이가부시끼가이샤
- 申请人地址： *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 专利权人： 히타치가세이가부시끼가이샤
- 当前专利权人： 히타치가세이가부시끼가이샤
- 当前专利权人地址： *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 代理人： 장수길; 박보현
- 优先权： JPJP-P-2010-051986 2010-03-09; JPJP-P-2011-022964 2011-02-04
- 国际申请： PCT/JP2011/054946 2011-03-03
- 国际公布： WO2011111605 2011-09-15
- 主分类号： H01P1/04
- IPC分类号： H01P1/04 ; H01P5/107 ; H05K3/46
The present invention provides an electromagnetic coupling structure used in the microwave band frequency band, and the inner dielectric layer 23 with a plurality of ground layers to the inner conductor layer 12, the sandwiched laminated between the 15 layered product and the laminate that pair of outer dielectric layer 21 of the sandwiching opposite between, 25 and a pair of outer dielectric layer 21, a pair of outer conductor layer 11, 16 of the facing each other (25) between the It includes a. The laminate had a hole (S) penetrating the inner conductor layer 12, 15, which is the inner dielectric layer 23 and a plurality of ground layers are provided, the tubular metal film formed on the inner wall of the hole (S) ( by 3) through a plurality of ground layers are inner conductive layers 12, 15 is electrically connected to that, it characterized in that the outer conductive layer (11), (16 pairs) are electromagnetically coupled.