基本信息:
- 专利标题： 경사진 에지를 가진 웨이퍼 캐리어
- 专利标题（英）：Wafer carrier with sloped edge
- 专利标题（中）：带边坡的拖车
- 申请号：KR1020127025825 申请日：2011-03-01
- 公开(公告)号：KR1020130007594A 公开(公告)日：2013-01-18
- 发明人： 미트로빅보얀 , 맨검조슈아 , 퀸윌리암이.
- 申请人： 비코 인스트루먼츠 인코포레이티드
- 申请人地址： * Terminal Drive, Plainview, NY *****, U.S.A.
- 专利权人： 비코 인스트루먼츠 인코포레이티드
- 当前专利权人： 비코 인스트루먼츠 인코포레이티드
- 当前专利权人地址： * Terminal Drive, Plainview, NY *****, U.S.A.
- 代理人： 유미특허법인
- 优先权： US61/309,995 2010-03-03
- 国际申请： PCT/US2011/026618 2011-03-01
- 国际公布： WO2011109348 2011-09-09
- 主分类号： H01L21/687
- IPC分类号： H01L21/687 ; C23C16/458 ; C23C16/455 ; C23C16/30
The wafer carrier 140 includes a body defining a central axis, a top surface of the substantially planar perpendicular to the central axis 141, and a pocket 143 is depressed down to receive a wafer on the top surface. The main body of the wafer carrier 140 may include a lip 180 projecting upwardly around the periphery of the top surface 141. Lip 180 may form an inclined lip surface 181, upward from the top surface of the plane (141) in a radially outward direction away from the central axis 142. The body may be configured to be mounted on the spindle 30 of the central shaft 142 of the spindle 30 and the processor 10 for achieve the axis of the body. Lip 180 can improve the pattern of the flow of gas from above the upper surface 141 of the wafer carrier (140).
信息查询:
EspacenetIPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |
| ----------H01L21/683 | ..用于支承或夹紧的 |
| ------------H01L21/687 | ...使用机械装置的，例如卡盘、夹具或夹子 |