基本信息:
- 专利标题: 지지체 금속박 부착 복합 금속층, 이것을 이용한 배선판과 그 제조방법, 이 배선판을 이용한 반도체 패키지의 제조방법
- 专利标题(英):Composite metal layer provided with supporting body metal foil, wiring board using the composite metal layer, method for manufacturing the wiring board, and method for manufacturing semiconductor package using the wiring board
- 专利标题(中):配有支撑体金属箔的复合金属层,使用复合金属层的接线板,制造接线板的方法以及使用接线板制造半导体封装的方法
- 申请号:KR1020127020047 申请日:2011-03-28
- 公开(公告)号:KR1020120115351A 公开(公告)日:2012-10-17
- 发明人: 타나베코이치 , 야기하시노부치카 , 타무라타다시 , 스즈키쿠니지 , 츠보마츠요시아키
- 申请人: 히타치가세이가부시끼가이샤
- 申请人地址: *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 专利权人: 히타치가세이가부시끼가이샤
- 当前专利权人: 히타치가세이가부시끼가이샤
- 当前专利权人地址: *-*, Marunouchi *-chome, Chiyoda-ku, Tokyo, ***-****, Japan
- 代理人: 특허법인원전
- 优先权: JPJP-P-2010-077334 2010-03-30; JPJP-P-2010-198620 2010-09-06
- 国际申请: PCT/JP2011/057556 2011-03-28
- 国际公布: WO2011122532 2011-10-06
- 主分类号: H01L23/12
- IPC分类号: H01L23/12 ; H05K3/20
Reduce the waste caused by the production of a circuit board and to provide a preferred support a metal foil attached to the composite metal layer, the wiring board and its manufacturing method using the same, a method for manufacturing a semiconductor package using the wiring board according to the global environment. As the support a metal foil of the lowermost metal layer and a composite metal substrate a metal foil adhered made are laminated through the release layer between the metal layer adjacent a plurality of the metal layer, consisting of two or more layers of metal layers, each of which is located between the metal layer of the lowest layer of the metal layer and the top layer with the metal layer (a) and the metal layer (C) the peel strength between the metal layer (B) is adjacent via the release layer of the upper surface, adjacent via the release layer of the metal layer (a) and, if that than the peel strength between the support characterized in that the small metal foil attached to the composite metal layer, the wiring board and its manufacturing method using the same, a method for manufacturing a semiconductor package using the wiring board.
公开/授权文献:
信息查询:
EspacenetIPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/12 | .安装架,例如不可拆卸的绝缘衬底 |